The German Patent and Trademark Office has granted the Chair FAPS a patent for the additive manufacturing of a DCB/DBC (direct copper bonded) ceramic circuit carrier. The core of the patent is the manufacturing process for additive manufacturing of a structured copper lamination on ceramics by means of selective laser melting (SLM) or electron beam melting (EBM). Concepts for avoiding delamination during the melting process by means of alloying elements and/or preheating are patented. This enables additive manufacturing of DCBs with high quality in the third dimension in the first place.
The patent was developed in the course of investigations into the additive manufacturing of circuit carriers for power electronics using SLM in the Electronics Production research area and underlines the innovative research activities of the chair in the field of electronics packaging.