2023

• Alzoubi K., Hensel A., Häußler F., Ottinger B., Sippel M., Franke J.:
  Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
  In: Journal of Electronic Packaging 145 (2023)
  ISSN: 1043-7398
  DOI: 10.1115/1.4056992
  BibTeX: Download
• Bartz M., Häußler F., Halmos F., Ankenbrand M., Jüttner M., Roudenko J., Wirsching S., Reichenberger M., Franke J., Wartzack S.:
  Use of Printed Sensors to Measure Strain in Rolling Bearings under Isolated Boundary Conditions
  In: Lubricants 11 (2023), p. 424
  ISSN: 2075-4442
  DOI: 10.3390/lubricants11100424
  BibTeX: Download
• Basu R., Siah KS., Distler A., Häußler F., Franke J., Brabec C., Egelhaaf HJ.:
  Aerosol-Jet-Printed Encapsulation of Organic Photovoltaics
  In: Advanced Engineering Materials (2023)
  ISSN: 1438-1656
  DOI: 10.1002/adem.202300322
  BibTeX: Download
• Utsch D., Häußler F., Sprenger M., Zirn J., Franke J.:
  Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication
  2023 15th International Congress Mechatronic Integration Discourse (Amberg, 21. June 2023 - 22. June 2023)
  In: 2023 15th International Congress Mechatronic Integration Discourse (MID), New York: 2023
  DOI: 10.1109/MID59615.2023.10461318
  BibTeX: Download
• Utsch D., Häußler F., Voigt C., Sippel M., Franke J.:
  Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
  46th International Spring Seminar on Electronics Technology (Timisoara, 10. May 2023 - 14. May 2023)
  DOI: 10.1109/ISSE57496.2023.10168526
  BibTeX: Download
• Voigt C., Petersen M., Thielen N., Utsch D., Häußler F., Kirchberger M., Franke J.:
  Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
  International Spring Seminar on Electronics Technology (Timisoara, 14. May 2023 - 17. July 2023)
  In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
  DOI: 10.1109/ISSE57496.2023.10168387
  BibTeX: Download

2022

• Bräuer P., Stoll T., Muckelbauer M., Häußler F., Hensel A., Franke J.:
  Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring
  2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
  DOI: 10.1109/ESTC55720.2022.9939487
  BibTeX: Download
• Häußler F., Sippel M., Sprenger M., Liu L., Muckelbauer M., Franke J.:
  High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints
  2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
  DOI: 10.1109/ESTC55720.2022.9939424
  BibTeX: Download

2021

• Häußler F., Schöttner J., Schubert J., Muckelbauer M., Spiecker E., Franke J.:
  Examining Ag-Ag Direct Bonding on Chemically Coated DBC Substrates as a Pasteless Die-Attach Approach
  PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (Nürnberg, 7. July 2021 - 8. July 2021)
  URL: https://ieeexplore.ieee.org/document/9472281
  BibTeX: Download

2020

• Häußler F., Petillon S., Dornheim J., Weser S., Eberhardt W., Zimmermann A., Franke J.:
  Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices
  43rd International Spring Seminar on Electronics Technology (ISSE) (Demanovska Valley, Slovakia, 14. May 2020 - 15. May 2020)
  In: 2020 43RD INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), NEW YORK: 2020
  DOI: 10.1109/ISSE49702.2020.9121136
  URL: https://ieeexplore.ieee.org/document/9121136
  BibTeX: Download
• Häußler F., Shen S., Petillon S., Weser S., Haybat M., Eberhardt W., Zimmermann A., Franke J.:
  Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging
  In: International Symposium on Microelectronics 2020 (2020), p. 000140-000145
  ISSN: 2380-4505
  DOI: 10.4071/2380-4505-2020.1.000140
  BibTeX: Download

2019

• Yu Z., Wang S., Letz S., Bayer CF., Häußler F., Schletz A., SUGANUMA K.:
  Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments
  2019 International Conference on Electronics Packaging (ICEP) (Niigata, Japan, 17. April 2019 - 20. April 2019)
  In: 2019 International Conference on Electronics Packaging (ICEP) 2019
  DOI: 10.23919/ICEP.2019.8733496
  URL: https://ieeexplore.ieee.org/document/8733496
  BibTeX: Download