Publications
2024
- Bartz M., Häußler F., Halmos F., Ankenbrand M., Jüttner M., Franke J., Wartzack S.:
Strain measurement on rolling bearings using sensors applied by aerosol-based deposition
Bearing World (Würzburg, 25. June 2024 - 26. June 2024)
BibTeX: Download - Utsch D., Sippel M., Voigt C., Häußler F., Franke J.:
Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication
In: Power Electronic Devices and Components 8 (2024), Article No.: 100067
ISSN: 2772-3704
DOI: 10.1016/j.pedc.2024.100067
BibTeX: Download
2023
- Alzoubi K., Hensel A., Häußler F., Ottinger B., Sippel M., Franke J.:
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
In: Journal of Electronic Packaging 145 (2023)
ISSN: 1043-7398
DOI: 10.1115/1.4056992
BibTeX: Download - Bartz M., Häußler F., Halmos F., Ankenbrand M., Jüttner M., Roudenko J., Wirsching S., Reichenberger M., Franke J., Wartzack S.:
Use of Printed Sensors to Measure Strain in Rolling Bearings under Isolated Boundary Conditions
In: Lubricants 11 (2023), p. 424
ISSN: 2075-4442
DOI: 10.3390/lubricants11100424
BibTeX: Download - Basu R., Siah KS., Distler A., Häußler F., Franke J., Brabec C., Egelhaaf HJ.:
Aerosol-Jet-Printed Encapsulation of Organic Photovoltaics
In: Advanced Engineering Materials (2023)
ISSN: 1438-1656
DOI: 10.1002/adem.202300322
BibTeX: Download - Utsch D., Häußler F., Sprenger M., Zirn J., Franke J.:
Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication
2023 15th International Congress Mechatronic Integration Discourse (Amberg, 21. June 2023 - 22. June 2023)
In: 2023 15th International Congress Mechatronic Integration Discourse (MID), New York: 2023
DOI: 10.1109/MID59615.2023.10461318
BibTeX: Download - Utsch D., Häußler F., Voigt C., Sippel M., Franke J.:
Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
46th International Spring Seminar on Electronics Technology (Timisoara, 10. May 2023 - 14. May 2023)
DOI: 10.1109/ISSE57496.2023.10168526
BibTeX: Download - Voigt C., Petersen M., Thielen N., Utsch D., Häußler F., Kirchberger M., Franke J.:
Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
International Spring Seminar on Electronics Technology (Timisoara, 14. May 2023 - 17. July 2023)
In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
DOI: 10.1109/ISSE57496.2023.10168387
BibTeX: Download
2022
- Bräuer P., Stoll T., Muckelbauer M., Häußler F., Hensel A., Franke J.:
Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
DOI: 10.1109/ESTC55720.2022.9939487
BibTeX: Download - Häußler F., Sippel M., Sprenger M., Liu L., Muckelbauer M., Franke J.:
High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
DOI: 10.1109/ESTC55720.2022.9939424
BibTeX: Download
2021
2020
- Häußler F., Petillon S., Dornheim J., Weser S., Eberhardt W., Zimmermann A., Franke J.:
Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices
43rd International Spring Seminar on Electronics Technology (ISSE) (Demanovska Valley, Slovakia, 14. May 2020 - 15. May 2020)
In: 2020 43RD INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), NEW YORK: 2020
DOI: 10.1109/ISSE49702.2020.9121136
URL: https://ieeexplore.ieee.org/document/9121136
BibTeX: Download - Häußler F., Shen S., Petillon S., Weser S., Haybat M., Eberhardt W., Zimmermann A., Franke J.:
Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging
In: International Symposium on Microelectronics 2020 (2020), p. 000140-000145
ISSN: 2380-4505
DOI: 10.4071/2380-4505-2020.1.000140
BibTeX: Download
2019
