Publications 2023 2022 Bräuer P. , Stoll T. , Muckelbauer M. , Hensel A. , Franke J. :Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies 72nd IEEE Electronic Components and Technology Conference (ECTC) (San Diego, CA )In: IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022) , NEW YORK : 2022 DOI: 10.1109/ECTC51906.2022.00162 BibTeX: Download Bräuer P. , Stoll T. , Muckelbauer M. , Häußler F. , Hensel A. , Franke J. :Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu , 13. September 2022 - 16. September 2022 ) DOI: 10.1109/ESTC55720.2022.9939487 BibTeX: Download Ockel M. , Hensel A. , Franke J. :Suitability of a 2 kw 515 nm Continous Wave Laser for Deep Penetration Welding of Copper 12th International Electric Drives Production Conference, EDPC 2022 (Virtual , 29. November 2022 - 30. November 2022 )In: 2022 12th International Electric Drives Production Conference, EDPC 2022 - Proceedings 2022 DOI: 10.1109/EDPC56367.2022.10019737 BibTeX: Download Sippel M. , Schmidt R. , Kaesbauer M. , Sprenger M. , Hensel A. , Franke J. :Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (Singapore , 7. December 2022 - 9. December 2022 )In: IEEE (ed.): Electronics Packaging Technology Conference (EPTC) 2022 DOI: 10.1109/EPTC56328.2022.10013275 BibTeX: Download Stoll T. , Feuerer T. , Hensel A. , Franke J. :Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF) Laser 3D Manufacturing IX 2022 (Virtual, Online , 20. January 2022 - 24. January 2022 )In: Bo Gu, Hongqiang Chen, Henry Helvajian (ed.): Proceedings of SPIE - The International Society for Optical Engineering 2022 DOI: 10.1117/12.2606382 BibTeX: Download 2020 2019 Hensel A. , Schwarzer C. , Merz C. , Stoll T. , Kaloudis M. , Franke J. :Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes 21st IEEE Electronics Packaging Technology Conference, EPTC 2019 (Singapore, SGP , 4. December 2019 - 6. December 2019 )In: 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019 2019 DOI: 10.1109/EPTC47984.2019.9026619 BibTeX: Download Schwarzer C. , Hensel A. , Roth F. , Merz C. , Franke J. , Kaloudis M. :Investigation of pressureless sintered interconnections on plasma based additive copper metallization for 3-dimentional ceramic substrates in high temperature applications 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019 (Pisa , 16. September 2019 - 19. September 2019 )In: 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019 2019 DOI: 10.23919/EMPC44848.2019.8951873 BibTeX: Download 2018 Hensel A. , Lê TA. , Sauermann A. , Franke J. :Investigations on Measuring the Thermal Conductivity of Alumina Substrates with Laser Flash Analysis International Spring Seminar on Electronics Technology, Institute of Electrical and Electronics Engineers et al. 2018 – 2018 41st International Spring Seminar (Zlatibor, Serbia )In: IEEE (ed.): 2018 41st International Spring Seminar on Electronics Technology (ISSE) 2018 DOI: 10.1109/ISSE.2018.8443661 BibTeX: Download Hensel A. , Müller M. , Franke J. :Einfluss der Beschichtungssequenz auf die Bauteiltemperatur während eines plasmabasierten Kupferbeschichtungsprozesses auf unterschiedlichen Substratmaterialien Elektronische Baugruppen und Leiterplatten
EBL 2018 (Fellbach, Deutschland )In: EBL 2018 : multifunktionale Aufbau- und Verbindungstechnik - Beherrschung der Vielfalt : Vorträge der 9. DVS/GMM-Tagung in Fellbach am 20. und 21. Februar 2018 2018 BibTeX: Download Hensel A. , Schwarzer C. , Scheetz M. , Kaloudis M. , Franke J. :Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations 20th IEEE Electronics Packaging Technology Conference (EPTC) (Singapore , 4. December 2018 - 7. December 2018 )In: 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) , NEW YORK : 2018 DOI: 10.1109/eptc.2018.8654421 BibTeX: Download 2017 Hensel A. , Kohlmann-von Platen K. , Franke J. :Investigations of Copper Wire Bonding Capability on Plasma Based Additive Copper Metallizations Electronics Packaging Technology Conference (Singapore , 6. December 2017 - 9. December 2017 )In: Proceedings of the 19th Electronics Packaging Technology Conference 2017 DOI: 10.1109/EPTC.2017.8277588 BibTeX: Download Hensel A. , Müller M. , Franke J. , Kohlmann-von Platen K. :System Concept of a Robust and Reproducible Plasma-Based Coating Process for the Manufacturing of Power Electronic Applications 7. WGP Jahreskongress (RWTH Aachen , 5. October 2017 - 6. October 2017 )In: Robert Schmitt; Günther Schuh (Hrsg.): (ed.): 7. WGP-Jahreskongress Aachen, 5.-6. Oktober 2017 , Aachen : 2017 BibTeX: Download Hensel A. , Müller M. , Kohlmann-von Platen K. , Franke J. :Additive Copper Metallization of Semiconductors for Enabling a Copper Wire Bonding Process 40th International Spring Seminar on Electronics Technology (ISSE) (Sofia , 10. May 2017 - 14. May 2017 )In: Proceedings of 40th International Spring Seminar on Electronics Technology (ISSE) (ed.): Proceedings of 40th International Spring Seminar on Electronics Technology (ISSE) 2017 BibTeX: Download