2023

• Alzoubi K., Hensel A., Häußler F., Ottinger B., Sippel M., Franke J.:
  Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
  In: Journal of Electronic Packaging 145 (2023)
  ISSN: 1043-7398
  DOI: 10.1115/1.4056992
  BibTeX: Download

2022

• Bräuer P., Stoll T., Muckelbauer M., Hensel A., Franke J.:
  Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies
  72nd IEEE Electronic Components and Technology Conference (ECTC) (San Diego, CA)
  In: IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), NEW YORK: 2022
  DOI: 10.1109/ECTC51906.2022.00162
  BibTeX: Download
• Bräuer P., Stoll T., Muckelbauer M., Häußler F., Hensel A., Franke J.:
  Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring
  2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (Sibiu, 13. September 2022 - 16. September 2022)
  DOI: 10.1109/ESTC55720.2022.9939487
  BibTeX: Download
• Ockel M., Hensel A., Franke J.:
  Suitability of a 2 kw 515 nm Continous Wave Laser for Deep Penetration Welding of Copper
  12th International Electric Drives Production Conference, EDPC 2022 (Virtual, 29. November 2022 - 30. November 2022)
  In: 2022 12th International Electric Drives Production Conference, EDPC 2022 - Proceedings 2022
  DOI: 10.1109/EDPC56367.2022.10019737
  BibTeX: Download
• Sippel M., Schmidt R., Kaesbauer M., Sprenger M., Hensel A., Franke J.:
  Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test
  2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (Singapore, 7. December 2022 - 9. December 2022)
  In: IEEE (ed.): Electronics Packaging Technology Conference (EPTC) 2022
  DOI: 10.1109/EPTC56328.2022.10013275
  BibTeX: Download
• Stoll T., Feuerer T., Hensel A., Franke J.:
  Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF)
  Laser 3D Manufacturing IX 2022 (Virtual, Online, 20. January 2022 - 24. January 2022)
  In: Bo Gu, Hongqiang Chen, Henry Helvajian (ed.): Proceedings of SPIE - The International Society for Optical Engineering 2022
  DOI: 10.1117/12.2606382
  BibTeX: Download

2020

• Schwarzer C., Hensel A., Roth F., Franke J., Kaloudis M.:
  Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates for Surface Acoustic Wave Sensors in High Temperature Applications
  70th IEEE Electronic Components and Technology Conference, ECTC 2020 (Orlando, FL, 3. June 2020 - 30. June 2020)
  In: Proceedings - Electronic Components and Technology Conference 2020
  DOI: 10.1109/ECTC32862.2020.00250
  BibTeX: Download

2019

• Hensel A., Schwarzer C., Merz C., Stoll T., Kaloudis M., Franke J.:
  Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes
  21st IEEE Electronics Packaging Technology Conference, EPTC 2019 (Singapore, SGP, 4. December 2019 - 6. December 2019)
  In: 2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019 2019
  DOI: 10.1109/EPTC47984.2019.9026619
  BibTeX: Download
• Schwarzer C., Hensel A., Roth F., Merz C., Franke J., Kaloudis M.:
  Investigation of pressureless sintered interconnections on plasma based additive copper metallization for 3-dimentional ceramic substrates in high temperature applications
  22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019 (Pisa, 16. September 2019 - 19. September 2019)
  In: 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019 2019
  DOI: 10.23919/EMPC44848.2019.8951873
  BibTeX: Download

2018

• Hensel A., Lê TA., Sauermann A., Franke J.:
  Investigations on Measuring the Thermal Conductivity of Alumina Substrates with Laser Flash Analysis
  International Spring Seminar on Electronics Technology, Institute of Electrical and Electronics Engineers et al. 2018 – 2018 41st International Spring Seminar (Zlatibor, Serbia)
  In: IEEE (ed.): 2018 41st International Spring Seminar on Electronics Technology (ISSE) 2018
  DOI: 10.1109/ISSE.2018.8443661
  BibTeX: Download
• Hensel A., Müller M., Franke J.:
  Einfluss der Beschichtungssequenz auf die Bauteiltemperatur während eines plasmabasierten Kupferbeschichtungsprozesses auf unterschiedlichen Substratmaterialien
  Elektronische Baugruppen und Leiterplatten EBL 2018 (Fellbach, Deutschland)
  In: EBL 2018 : multifunktionale Aufbau- und Verbindungstechnik - Beherrschung der Vielfalt : Vorträge der 9. DVS/GMM-Tagung in Fellbach am 20. und 21. Februar 2018 2018
  BibTeX: Download
• Hensel A., Schwarzer C., Scheetz M., Kaloudis M., Franke J.:
  Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations
  20th IEEE Electronics Packaging Technology Conference (EPTC) (Singapore, 4. December 2018 - 7. December 2018)
  In: 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), NEW YORK: 2018
  DOI: 10.1109/eptc.2018.8654421
  BibTeX: Download

2017

• Hensel A., Kohlmann-von Platen K., Franke J.:
  Investigations of Copper Wire Bonding Capability on Plasma Based Additive Copper Metallizations
  Electronics Packaging Technology Conference (Singapore, 6. December 2017 - 9. December 2017)
  In: Proceedings of the 19th Electronics Packaging Technology Conference 2017
  DOI: 10.1109/EPTC.2017.8277588
  BibTeX: Download
• Hensel A., Müller M., Franke J., Kohlmann-von Platen K.:
  System Concept of a Robust and Reproducible Plasma-Based Coating Process for the Manufacturing of Power Electronic Applications
  7. WGP Jahreskongress (RWTH Aachen, 5. October 2017 - 6. October 2017)
  In: Robert Schmitt; Günther Schuh (Hrsg.): (ed.): 7. WGP-Jahreskongress Aachen, 5.-6. Oktober 2017, Aachen: 2017
  BibTeX: Download
• Hensel A., Müller M., Kohlmann-von Platen K., Franke J.:
  Additive Copper Metallization of Semiconductors for Enabling a Copper Wire Bonding Process
  40th International Spring Seminar on Electronics Technology (ISSE) (Sofia, 10. May 2017 - 14. May 2017)
  In: Proceedings of 40th International Spring Seminar on Electronics Technology (ISSE) (ed.): Proceedings of 40th International Spring Seminar on Electronics Technology (ISSE) 2017
  BibTeX: Download