Vertreter des Projektkonsortiums

The three-year research project „Additive4Industry – Printed electronics on 3D substrates (A4I/PE3D)”, funded by BMBF (Bundesministerium für Bildung und Forschung) and administered by Projektträger Jülich, investigated additively manufactured ceramic cirucit carriers for electronic assemblies as well as their metallization and qualification.

With rising performance, electronic systems meet also increasing requirements in terms of improved electric isolation and thermal conductivity. At the same time, planar modules reach their limits regarding freedom of design and small lot sizes.
Therefore, the technical consortium (FAPS, Conti Temic microelectronic GmbH, Neotech AMT GmbH and GSB-Wahl GmbH as well as TNO/Holst Centre as associated international partner) investigated the usage of ceramic materials for additive manufacturing of the substrates (mainly alumina and LTCC ceramic). Commercially available functional inks as well as self-made formulations from GSB-Wahl were applied on complex ceramic surfaces using piezojet-printing and were characterized and analyzed extensively.
During the project, organization and numerous valuable networking events were conducted by Cluster mechatronik&automation (Bayern innovativ) und its Dutch pendant Brainport Development.

The results show the potentials of ceramic 3D-substrates for electronic assemblies and their selective metallization. Hence, research in this field is further driven by FAPS, for example in the project, which has started this year, MultiPower.

We express our gratitude towards BMBF and Projektträger Jülich for funding and supporting this project!