PrInterfaces

Project term:	April 2022 - April 2024
Contact FAPS:
Project partners:	Technische Hochschule Nürnberg Georg Simon Ohm - Institut für Chemie, Material- und Produktentwicklung: Labor für Aufbau- und Verbindungstechnik
Associated partners:	DICO Electronic, RFPlast, panacol, Neotech AMT, hartmann.gs, Jürgenhake, alpha-board, Seho, MSWtech, nanowired, Automatic Research, vitesco, zollner, inContAlert
Sponsors:	Federal Ministry of Economics and Climate Protection (BMWK) via the German Federation of Industrial Research Associations (AIF)

Project description

The aim of the PrInterfaces project is to research technologies for the high-quality contacting of printed structures for the establishment of Level 3 connections between electronic assemblies. Four promising technologies have been identified for this purpose: pierced-through and around crimping, stirrup soldering, ACF heat sealing and press-fit technology, which are being investigated in a structured manner by the two research centers. The FAPS chair is looking at ACF heat sealing, which is known as a precise and reliable process and is very suitable for flexible substrates, and press-fit technology. This solderless process is already used in other areas of electronics production to create reliable and durable connections. The main focus is on the assessment of long-term reliability and the modeling of failure mechanisms.

The research project focuses on the following aspects:

Creation of a requirements catalog with the associated partners
Fabrication of test structures and assembly of the contacting systems
Analysis of long-term reliability
Development of a user guide