Technical specification

Manufacturer In-house development
Base X400 Pro V3, innovatiQ
Start of operation Q1 2021
Technology Direct Ink Writing (DIW)
Build volume (w ∗ d ∗ h) 270 mm ∗ 350 mm ∗ 200 mm
Material RTV-2 silicone, LSR
Data transfer SD card / USB
Software Pronterface
Field of usage Silicone components for applications in medical technology or mechanical engineering