14th International Congress Molded Interconnect Devices (MID) 2021

The 14th International Congress Molded Interconnect Devices (MID) 2021 will take place on February 9 and 10, 2021 in the Amberg Congress Centrum (ACC). Use this opportunity to get an overview of MID technologies, to gain deep insight into the details of the individual technologies and to network with companies and research institutions in the industry. Please register for the congress under this link.

MID 2021

At this year’s MID Congress, 36 presentations from industry and science will be presented. Among other things, you will receive the latest information on innovative materials, printed electronics, additive manufacturing and printing technologies. This is the ideal opportunity to inform, exchange and discuss the current state of the art. The presentations will be divided into parallel sessions that are oriented towards specific target groups. An industrial exhibition will be held at the same time. On the evening of February 9th there will be a beer tasting followed by a joint dinner, which is included in the congress fees. In addition, a technical tour can be booked after the congress, which this year will take you to the Siemens Amberg showcase plant for Industry 4.0.

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