2025

• Piechulek N., Xu L., Fröhlich J., Bründl P., Franke J.:
  Miniaturization Potential of Additive-Manufactured 3D Mechatronic Integrated Device Components Produced by Stereolithography
  In: Micromachines 16 (2025), Article No.: 16
  ISSN: 2072-666X
  DOI: 10.3390/mi16010016
  BibTeX: Download

2024

• Ankenbrand M., Panusch D., Piechulek N., Gold G., Helmreich K., Franke J.:
  Investigating Laser Direct Structuring and Aerosol-Jet for Additively Manufactured Helix Antennas
  23rd International Conference on Electronics Packaging, ICEP 2024 (Toyama, JPN, 17. April 2024 - 20. April 2024)
  In: 2024 International Conference on Electronics Packaging, ICEP 2024 2024
  DOI: 10.23919/ICEP61562.2024.10535565
  BibTeX: Download
• Ankenbrand M., Piechulek N., Mutlu E., Franke J.:
  Feasibility and Performance of Fully Additive Manufactured Light Bulbs
  26th Electronics Packaging Technology Conference, EPTC 2024 (Singapore, SGP, 3. December 2024 - 6. December 2024)
  In: Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui (ed.): Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024 2024
  DOI: 10.1109/EPTC62800.2024.10909948
  BibTeX: Download
• Fröhlich J., Piechulek N., Nguyen HG., Franke J., Jurgenhake C.:
  Reliable and Automated Connection of Printed Electronics to the Aviation Electrical System
  2024 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2024 (Kona, Big Island, HI, USA, 29. January 2024 - 1. February 2024)
  In: 2024 Pan Pacific Strategic Electronics Symposium, Pan Pacific 2024 2024
  DOI: 10.23919/PanPacific60013.2024.10436443
  BibTeX: Download
• Piechulek N., Ankenbrand M., Xu L., Fröhlich J., Nguyen H., Bründl P., Franke J.:
  Innovations and Challenges in Laser Direct Structured Mechatronic Integrated Devices for Aviation: Material Development, Component Design, and Additive Manufacturing
  26th Electronics Packaging Technology Conference, EPTC 2024 (Singapore, SGP, 3. December 2024 - 6. December 2024)
  In: Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui (ed.): Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024 2024
  DOI: 10.1109/EPTC62800.2024.10909947
  BibTeX: Download

2023

• Fröhlig S., Nguyen HG., Piechulek N., Franke J.:
  Innovative robot tool for full-automatic handling and wiring of deformable linear cables
  56th CIRP International Conference on Manufacturing Systems, CIRP CMS 2023 (Cape Town, ZAF, 24. October 2023 - 26. October 2023)
  In: Khumbulani Mpofu, Natasha Sacks, Oliver Damm (ed.): Procedia CIRP 2023
  DOI: 10.1016/j.procir.2023.12.006
  BibTeX: Download

2022

• Thielen N., Pan W., Piechulek N., Voigt C., Meier S., Schmidt K., Franke J.:
  Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, SGP, 7. December 2022 - 9. December 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013210
  BibTeX: Download
• Utsch D., Piechulek N., Franke J.:
  Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity
  45th International Spring Seminar on Electronics Technology (ISSE) (Wien, 11. May 2022 - 15. May 2022)
  DOI: 10.1109/ISSE54558.2022.9812778
  BibTeX: Download

2020

• Fröhlig S., Piechulek N., Friedlein M., Süß-Wolf R., Schmidt L., Kuhn M., Wang L., Hefner F., Heisler P., Fröhlich J., Meiners M., Franke J.:
  Innovative signal and power connection solutions for alternative powertrain concepts
  In: 2020 10th International Electric Drives Production Conference (EDPC) 2020
  DOI: 10.1109/EDPC51184.2020.9388180
  BibTeX: Download