2024

• Hecht C., Ockel M., Stoll T., Franke J.:
  Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating
  SPIE LASE (San Francisco)
  In: Proceedings Volume 12876, Laser 3D Manufacturing XI 2024
  DOI: 10.1117/12.3001350
  BibTeX: Download
• Ockel M., Funk F., Janisch L., Franke J.:
  Evaluation of the Cold Atmospheric Plasma Metallization of Bare Dies with Copper Through Life Cycle Assessment
  In: Thomas Bauernhansl, Alexander Verl, Mathias Liewald, Hans-Christian Möhring (ed.): Production at the Leading Edge of Technology. Proceedings of the 13th Congress of the German Academic Association for Production Technology (WGP), Freudenstadt, November 2023, Cham: Springer Nature Switzerland, 2024, p. 417-427 (Lecture Notes in Production Engineering)
  ISBN: 978-3-031-47394-4
  DOI: 10.1007/978-3-031-47394-4_41
  BibTeX: Download

2023

• Ockel M., Janisch L., Franke J., Schlichting J., Breuer M.:
  Enhancing Flexibility in Power Electronics Production: A Study on Robotic Handling of Copper Clips for Laser Bonding
  11th International Conference on Control, Mechatronics and Automation, ICCMA 2023
  DOI: 10.1109/ICCMA59762.2023.10374891
  BibTeX: Download
• Ockel M., Sippel M., Hecht C., Janisch L., Franke J.:
  A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing
  DOI: 10.1109/EPTC59621.2023.10457786
  BibTeX: Download

2022

• Ockel M., Hensel A., Franke J.:
  Suitability of a 2 kw 515 nm Continous Wave Laser for Deep Penetration Welding of Copper
  12th International Electric Drives Production Conference, EDPC 2022 (Virtual, 29. November 2022 - 30. November 2022)
  In: 2022 12th International Electric Drives Production Conference, EDPC 2022 - Proceedings 2022
  DOI: 10.1109/EDPC56367.2022.10019737
  BibTeX: Download
• Seidel R., Ockel M., Franke J., Kästle C.:
  Impact of THT-hole dimensioning on manufacturability in selective wave soldering
  In: Microelectronics Reliability 137 (2022), p. 114773
  ISSN: 0026-2714
  DOI: 10.1016/j.microrel.2022.114773
  BibTeX: Download