Publications
2024
- Ockel M., Gökçen A., Ottinger B., Petersen M., Voigt C., Franke J.:
Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering
International Thermal Spray Conference and Exposition (Mailand, 29. April 2024 - 1. May 2024)
In: ITSC 2024 International Thermal Spray Conference and Exposition. Conference Proceedings and Poster Sessions, Düsseldorf: 2024
BibTeX: Download - Ottinger B., Holverscheid J., König S., Brunner A., Müller L., Goth C., Franke J.:
Investigations Selected Influencing of Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-attach Method for Automotive Power Modules
In: Advancing Microelectronics 51 (2024), p. 6-10
ISSN: 2222-8748
BibTeX: Download
2023
- Alzoubi K., Hensel A., Häußler F., Ottinger B., Sippel M., Franke J.:
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
In: Journal of Electronic Packaging 145 (2023)
ISSN: 1043-7398
DOI: 10.1115/1.4056992
BibTeX: Download - Ottinger B., Holverscheid J., König S., Brunner A., Müller L., Goth C., Franke J.:
Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as die-attach method for automotive power modules
International Conference and Exhibition on High Temperature Electronics (HITEC 2023) (Albuquerque, 18. April 2023 - 20. April 2023)
BibTeX: Download - Ottinger B., Mathew A., König S., Albrecht J., Sprenger M., Müller L., Goth C., Franke J.:
Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation
In: Microelectronics Reliability (2023), Article No.: 115097
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2023.115097
BibTeX: Download - Sprenger M., Kramer M., Tolyschew E., Steinau M., Renner D., Ottinger B., Franke J.:
Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 (Graz, 16. April 2023 - 19. April 2023)
In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 2023
DOI: 10.1109/EuroSimE56861.2023.10100795
BibTeX: Download
2022
- Ottinger B., Holverscheid J., Konig S., Jerichow E., Lunz S., Sprenger M., Muller L., Goth C., Franke J.:
Reliability of lead-free solders for die attach in automotive power modules
24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. December 2022 - 9. December 2022)
In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
DOI: 10.1109/EPTC56328.2022.10013246
BibTeX: Download - Ottinger B., Murk S., König S., Zangarro A., Müllmaier M., Müller L., Franke J.:
Location dependent down-rating of voids in high power solder connections for automotive power modules
DOI: 10.4071/001c.89938
BibTeX: Download - Ottinger B., Murk S., König S., Zangarro A., Müllmaier M., Müller L., Franke J.:
Location dependent down-rating of voids in high power solder connections for automotive power modules
Conference of High Temperature Electronics Network (HITEN 2022) (St. Anne's College, Oxford, 18. July 2022 - 22. July 2022)
DOI: 10.4071/001c.89938
BibTeX: Download - Sprenger M., Forndran F., Ottinger B., Braun T., Franke J.:
Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation
CIPS 2022 (Berlin, 15. March 2022 - 17. March 2022)
In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022), Berlin and Offenbach: 2022
BibTeX: Download - Sprenger M., Forndran F., Ottinger B., Dammann T., Erben B., Sippel M., Franke J.:
Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation
23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (St Julian, 25. April 2022 - 27. April 2022)
In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 2022
DOI: 10.1109/EuroSimE54907.2022.9758880
BibTeX: Download
2020
