Christoph Hecht, M. Sc.
Relevant News
2022
2021
Publications
2024
Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating
SPIE LASE (San Francisco)
In: Proceedings Volume 12876, Laser 3D Manufacturing XI 2024
DOI: 10.1117/12.3001350
BibTeX: Download , , , :
2023
Investigations on processing copper-titanium powder blends via PBF-LB/M
In: Lasers in Manufacturing, 2023
URL: https://wlt.de/sites/default/files/2023-09/Contribution_112.pdf
BibTeX: Download , , , , :
A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing
DOI: 10.1109/EPTC59621.2023.10457786
BibTeX: Download , , , , :
2022
Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production
28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. October 2022 - 29. October 2022)
In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
DOI: 10.1109/SIITME56728.2022.9987997
BibTeX: Download , , , , , :
Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors
9th IEEE Electronics System-Integration Technology Conference, ESTC 2022 (Sibiu, 13. September 2022 - 16. September 2022)
In: 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings 2022
DOI: 10.1109/ESTC55720.2022.9939542
BibTeX: Download , , , , , :
Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. December 2022 - 9. December 2022)
In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
DOI: 10.1109/EPTC56328.2022.10013218
BibTeX: Download , , , , , :