The exact quantification of filling levels of special solder joints proves to be a particular challenge in electronics production.
Within the scope of this work, an evaluation procedure is to be developed on a test circuit board, which can determine the filling level of a given, exemplary solder joint on the basis of a single X-ray image.
First of all, the image acquisition of simple, exemplary soldering structures shall be simulated. The resulting image data will then be used as a basis for a programme for the evaluation of real image data.
For this purpose basic knowledge in image processing and Python programming is necessary and can be acquired during the work.
Requirements
- Independent and responsible way of working
- Communication skills
- Clean and complete documentation of all results
Prior knowledge
- Very good knowledge of German and / or English, written and spoken
- Basic programming knowledge
- Basic knowledge of electronics production
Task definition
- Development of a test procedure
- Simulation of the X-ray image
- Generation of an artificial training data set
- Evaluation of real solder joints Based on the simulation data
If you are interested
For further information please contact Christian Voigt.
Application by email with curriculum vitae and current grade overview to: Christian.Voigt@faps.fau.de







