Publications 2024 Rachinger B. , Seidel R. , Meier S. , Franke J. :Optimierung der Prozessparameter beim Selektivwellenlöten mit Hilfe von Offline Reinforcement Learning EBL Fellbach (Fellbach 5. March 2024 - 6. March 2024 )In: GMM-Fb. 107: EBL 2024 – Elektronische Baugruppen und Leiterplatten 2024 https://www.vde-verlag.de/buecher/456265/gmm-fb-107-ebl-2024-elektronische-baugruppen-und-leiterplatten.html Download Thielen N. , Rachinger B. , Schröder F. , Preitschaft A. , Meier S. , Seidel R. , Reinhardt A. , Franke J. :Comparative Study on Different Methods to Generate Synthetic Data for the Classification of THT Solder Joints 2024 1st International Conference on Production Technologies and Systems for E-Mobility (Bamberg 5. June 2024 - 6. June 2024 )In: 2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS) , New York City 2024 10.1109/EPTS61482.2024.10586740 Download 2023 2022 Seidel R. , Ahrens T. , Friedrich J. , Reinhardt A. , Franke J. :Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering Microelectronics Reliability 131 2022 ), p. 114497 ISSN: 0026-2714 10.1016/j.microrel.2022.114497 Download Seidel R. , Ockel M. , Franke J. , Kästle C. :Impact of THT-hole dimensioning on manufacturability in selective wave soldering Microelectronics Reliability 137 2022 ), p. 114773 ISSN: 0026-2714 10.1016/j.microrel.2022.114773 Download Seidel R. , Schmidt K. , Thielen N. , Franke J. :Trustworthiness of machine learning models in manufacturing applications using the example of electronics manufacturing processes 55th CIRP Conference on Manufacturing Systems, CIRP CMS 2022 (Lugano 29. June 2022 - 1. July 2022 )In: Anna Valente, Emanuele Carpanzano, Claudio Boer (ed.): Procedia CIRP 2022 10.1016/j.procir.2022.05.013 Download Seidel R. , Sippel M. , Franke J. :2-D Fluid Simulation Approach for Miniwave Soldering 10.1109/ECTC51906.2022.00281 Download Sippel M. , Schmidt R. , Rau F. , Bretscher D. , Seidel R. , Franke J. :Improved Thermal Impedance Measurement for Power Modules based on Thermal Imaging of the Baseplate 12th International Conference on Integrated Power Electronics Systems (CIPS 2022) (Berlin, Germany 15. March 2022 - 17. March 2022 )In: Proceedings of the 12th International Conference on Integrated Power Electronics Systems (CIPS 2022) , Berlin and Offenbach 2022 Download 2021 Seidel R. , Sippel M. , Franke J. :An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering IEEE 71st Electronic Components and Technology Conference (ECTC) (, ELECTR NETWORK In: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) , LOS ALAMITOS 2021 10.1109/ECTC32696.2021.00228 Download Thielen N. , Jiang Z. , Schmidt K. , Seidel R. , Voigt C. , Reinhardt A. , Franke J. :Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Timisoara In: 2021 IEEE 27TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2021) , NEW YORK 2021 10.1109/SIITME53254.2021.9663663 Download 2020 Schmidt K. , Thielen N. , Voigt C. , Seidel R. , Franke J. , Milde Y. , Bonig J. , Beitinger G. :Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti 21. October 2020 - 24. October 2020 )In: IEEE (ed.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020 10.1109/SIITME50350.2020.9292292 Download Seidel R. , Hassan Amada M. , Fuchs J. , Thielen N. , Schmidt K. , Voigt C. , Franke J. :Data Mining System Architecture for Industrial Internet of Things in Electronics Production 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti 21. October 2020 - 24. October 2020 )In: IEEE (ed.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020 10.1109/SIITME50350.2020.9292282 Download Seidel R. , Leibold F. , Thielen N. , Franke J. :Prediction of the Solder Rise in Selective Wave Soldering Comparing Decision Tree and Logistic Regression 10.1109/ISSE49702.2020.9121028 https://ieeexplore.ieee.org/document/9121028 Download Seidel R. , Thielen N. , Schmidt K. , Voigt C. , Franke J. :Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti 21. October 2020 - 24. October 2020 )In: IEEE (ed.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020 10.1109/SIITME50350.2020.9292175 Download Seidel R. , Thielen N. , Voigt C. , Franke J. :Thermische Beurteilung von THT-Lötstellendesigns für die IPC-konforme Kontaktierung durch Selektivwellenlöten EBL 2020 (Fellbach 18. February 2020 - 19. February 2020 )Download Seidel R. , Volland J. , Thielen N. , Voigt C. , Franke J. :Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement ISSE 2020 10.1109/ISSE49702.2020.9120918 Download Thielen N. , Schmidt K. , Seidel R. , Franke J. :Maschinelles Lernen in der Elektronikproduktion: Herausforderungen und Anwendungsmöglichkeiten EBL 2020 – Elektronische Baugruppen und Leiterplatten - 10. DVS/GMM-Tagung (Fellbach 18. February 2020 - 19. February 2020 )In: VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik (GMM) (ed.): GMM-Fb. 94: EBL 2020 – Elektronische Baugruppen und Leiterplatten 2020 Download Thielen N. , Werner D. , Schmidt K. , Seidel R. , Reinhardt A. , Franke J. :A Machine Learning Based Approach to Detect False Calls in SMT Manufacturing 43rd International Spring Seminar on Electronics Technology, ISSE 2020 (Demanovska Valley 14. May 2020 - 15. May 2020 )In: Proceedings of the International Spring Seminar on Electronics Technology 2020 10.1109/ISSE49702.2020.9121044 Download 2019 Mayr A. , Kißkalt D. , Meiners M. , Lutz B. , Schäfer F. , Seidel R. , Selmaier A. , Fuchs J. , Metzner M. , Blank A. , Franke J. :Machine Learning in Production – Potentials, Challenges and Exemplary Applications 7th CIRP Global Web Conference – Towards shifted production value stream patterns through inference of data, models, and technology (CIRPe 2019) (Online 16. October 2019 - 18. October 2019 )In: Procedia CIRP 2019 10.1016/j.procir.2020.01.035 https://www.sciencedirect.com/science/article/pii/S2212827120300445?via=ihub Download Seidel R. , Mayr A. , Schäfer F. , Kißkalt D. , Franke J. :Towards a Smart Electronics Production Using Machine Learning Techniques 42nd International Spring Seminar on Electronics Technology (ISSE) (Wroclaw 15. September 2019 - 19. May 2019 )In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE) 2019 10.1109/ISSE.2019.8810176 https://ieeexplore.ieee.org/document/8810176 Download
