2022

• Thielen N., Pan W., Piechulek N., Voigt C., Meier S., Schmidt K., Franke J.:
  Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, SGP, 7. December 2022 - 9. December 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013210
  BibTeX: Download
• Utsch D., Piechulek N., Franke J.:
  Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity
  45th International Spring Seminar on Electronics Technology (ISSE) (Wien, 11. May 2022 - 15. May 2022)
  DOI: 10.1109/ISSE54558.2022.9812778
  BibTeX: Download

2020

• Fröhlig S., Piechulek N., Friedlein M., Süß-Wolf R., Schmidt L., Kuhn M., Wang L., Hefner F., Heisler P., Fröhlich J., Meiners M., Franke J.:
  Innovative signal and power connection solutions for alternative powertrain concepts
  In: 2020 10th International Electric Drives Production Conference (EDPC) 2020
  DOI: 10.1109/EDPC51184.2020.9388180
  BibTeX: Download