Christian Voigt, M. Sc.
Current thesis projects
Relevant News
2023
Publications
2023
Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
46th International Spring Seminar on Electronics Technology (Timisoara, 10. May 2023 - 14. May 2023)
DOI: 10.1109/ISSE57496.2023.10168526
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Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
International Spring Seminar on Electronics Technology (Timisoara, 14. May 2023 - 17. July 2023)
In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
DOI: 10.1109/ISSE57496.2023.10168387
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2022
Simulationsgestütztes Vorgehensmodell zur Realisierung einer Matrixfertigung
In: Zeitschrift Kunststofftechnik 117 (2022), p. 224-228
ISSN: 1864-2217
DOI: 10.1515/zwf-2022-1037
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Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production
24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, SGP, 7. December 2022 - 9. December 2022)
In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
DOI: 10.1109/EPTC56328.2022.10013210
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2021
An Automated Optical Inspection System for PIP Solder Joint Classification Using Convolutional Neural Networks
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (San Diego, CA, 1. June 2021 - 4. July 2021)
In: IEEE (ed.): IEEE 2021
DOI: 10.1109/ECTC32696.2021.00346
URL: https://ieeexplore.ieee.org/document/9501916
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Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing
IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Timisoara)
In: 2021 IEEE 27TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2021), NEW YORK: 2021
DOI: 10.1109/SIITME53254.2021.9663663
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Evaluation of Influences on Accuracy of Radiographic Measurements of Solder Joint Volume
44th International Spring Seminar on Electronics Technology, ISSE 2021 (Bautzen, DEU, 5. May 2021 - 9. May 2021)
In: Proceedings of the International Spring Seminar on Electronics Technology 2021
DOI: 10.1109/ISSE51996.2021.9467562
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An Analysis of Redundancy in High Volume High Mix Quality Testing Systems in Electronics Production
44th International Spring Seminar on Electronics Technology, ISSE 2021 (Bautzen, DEU, 5. May 2021 - 9. May 2021)
In: Proceedings of the International Spring Seminar on Electronics Technology 2021
DOI: 10.1109/ISSE51996.2021.9467650
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2020
Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. October 2020 - 24. October 2020)
In: IEEE (ed.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
DOI: 10.1109/SIITME50350.2020.9292292
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Data Mining System Architecture for Industrial Internet of Things in Electronics Production
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. October 2020 - 24. October 2020)
In: IEEE (ed.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
DOI: 10.1109/SIITME50350.2020.9292282
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Development and Test of a Data Framework for Prediction of Soldering Quality in Selective Wave Soldering Applying K-Nearest Neighbors
2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) (Pitesti, 21. October 2020 - 24. October 2020)
In: IEEE (ed.): 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) 2020
DOI: 10.1109/SIITME50350.2020.9292175
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Thermische Beurteilung von THT-Lötstellendesigns für die IPC-konforme Kontaktierung durch Selektivwellenlöten
EBL 2020 (Fellbach, 18. February 2020 - 19. February 2020)
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Experimental Investigation on Thermocouple Attachment Methods for Reliable Temperature Measurement
ISSE 2020
DOI: 10.1109/ISSE49702.2020.9120918
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Evaluation verschiedener Ansätze zur vollautomatisierten Montage von Weicheisenkernen auf Flachbaugruppen in traditionellen SMD-Linien
EBL 2020 – Elektronische Baugruppen und Leiterplatten - 10. DVS/GMM-Tagung (Fellbach, 18. February 2020 - 19. February 2020)
In: EBL 2020 - Elektronische Baugruppen und Leiterplatten 2020
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