DFG funds project “Additive manufacture of metal-ceramic composites using selective laser melting for power electronic applications”.
Conventional methods for the production of circuit carriers are usually based on lamination processes with the subsequent usage of subtractive processes such as chemical etching. Additive manufacturing allows the generation of selective and three-dimensional metallizations on dielectric substrates. Thus, flexible circuit carriers can be produced without the use of tools and subsequent manufacturing steps. In this research project, prefabricated Al2O3-ceramics are metallized additiveley by selective laser melting (SLM). For the metallization, a material combination of copper and titanium powder is used in order to achieve the highest possible electrical conductivity as well as suitable adhesive strengths for power electronics. In the project, in particular the fundamental bonding mechanisms of molten powder materials to the ceramic substrate are investigated in detail. Dependencies with respect to the resulting reaction zones and the stability of the process are to be investigated on the basis of different Cu-Ti compositions and the application of different process parameters. The metallizations produced will then be subjected to various qualitative tests such as adhesion testing as well as analysis of the electrical conductivity and long-term stability.