Laser cladding allows for a fast, flexible and direct plotting of electric conductive structures on MID. The surface of the substrate is *ively melted by a focused laser beam. Simultaneously, a metal powder is lead through a powder nozzle. This nozzle is oriented laterally or coaxially to the laser beam. As a result, a molten bath of substrate and powder material is created. After cooling and solidification a welding bead on the substrate surface is formed.

Objectives

• Characterization of the Laser Cladding process for the direct preparation of electrical conductive structures on polymer.
• Qualification of combinations of new MID relevant polymers and different metals for high current applications.
• Rationalization of the manufacturing process chain.