Cooperation

Electronics Production

 
The group of Electronics Production presents and provides a wide range of facilities and equipment which are highlighted in following table. For further questions and inquiries concerning a specific equipment, please contact Mr. Denis Kozic.
Optical Tests
Equipment Equipment information Testing options (for example)
X-Ray Machine
MACROTRON MXR 160
Real-time X-Ray (5-Axis Manipulator)
Resolution: 2/3 µm, Magnification: 1500-fach
Tube voltage: 160 kV
Frames of THT-Solder joints
Hidden connecttions (BGA)
Damage Analysis
X-Ray fluorescence
Fischerscope XDLM-C4 XYZ
X-Ray tube: 50kV
Z-Hup: up to 80mm
Layer thickness measurement
X-Ray System Nordson Dage Detector: flat panel < 100nm
LP size: 29″ x 22.8″ (736 x 580 mm) max.
Zoom: 2,500 X, System 7,100 X
Large scale recording of 3D objects
Light Microscope
NIKON SMZ 1500
Zoom: 15:1
High resolution measurement microscope
(3840 x 3072 Pixel)
Plane wise analysis
Surface analysis
Measurement tasks
Area-Array-Microscope
ERSASCOPE
High-resolution BGA-Endoscopic Optic
(≤ 300 µm)
BGA-Inspection
Sideview
Surface analysis device
UBM Messtechnik
Autofocus range: ±50 µm, ±500 µm
Laser triangulation: ±5000 µm
Roughness measurement
Surface analysis
Height profile, Surface measurement
Optical Multisensor device
Werth Messtechnik
Video Check IP 400 HA
Fixed/Zoom-Optics, Laser
Through-, reflected- und Ringlight
Accuracy: ca. 0,7 µm
Position accuracy
Offset, Rotation
Height profile measurement
Optical inspection device
SIPLACE OS
Automatic inspection of PCBs Automatic inspection of PCBs
Thermal Imaging camera
FLIR ThermaCAM S65 HS
Temperature range: -40°C bis 1500°C
Thermal sensitivity: 0,05°C
Accuracy: ±2°C, ±2% of values
Contactless temperature measurement
High Speed Camera
VDS Vosskühler
Accuracy: 1024 x1024 Pixel (462 fps), S/W
max. 1825 fps at 1024 x 256 Pixel
High speed Photography
Time motion
Film-thickness measurement device
Fischerscope XUVM
X-Ray flouresence
X-Ray voltage: 50 kV
Triple laer thickness
Alloy layer measurement
Material analysis, Identification
3D Laserscan-Microscope
KEYENCE VK-9700
18.000-X Zoom
Resolution: 1nm
Contactless 3D-Mesurement
Profile-, Roughness-, 
True-color view
Solder volume measurement device
KOHYOUNG
xy-Resolution 20µm, z-Resolution: 3,7µm
Max. Paste height: 400µm
PCB-size: Max. 460 x 410 mm / Min. 50 x 50 mm
Mesurement of Volume, Surface, Height,
Offsets, Bridges, Shape-defects analysis
Materialography Preparation of components and materials Analysis of materials, connections,etc.
Climate and Environmental tests
Equipment Equipment information Testing options (for example)
Climatic test chamber
WEISS SB11/160
Temperature range: -40°C bis +180°C
Humidity rance: 10% bis 95% r. F.
Cooling: 3,5 K/min, Heating: 3,3 K/min
Test-room in mm: 675 x 540 x 435
Temperature change
Climate tests
Climatic test chamber
WEISS SB11/300
Temperature range: -75°C bis +180°C
Humidity range: 10% bis 95% r. F.
Cooling: 1,8 K/min, Heating: 3,0 K/min
Test room in mm: 675 x 540 x 810
Temperature change
Climate tests
Temperature shock test chamber
WEISS TS 130
Temperature range: -80°C bis +220°C
Test room in mm: 450 x 500 x 600
Change time b/n Warm & Cold chambers: 10 s
Temperature shock
Shaker with climate chamber
RMS / VÖTSCH
Frequency: 0 – 5000 Hz
Acceleration: max. 100g
Temperature range: -40°C bis +180°C
Sine: 2,9 kN
Noise: 2,2 kN
Shock: 5 kN
Vacuum drying chamber
BINDER
Maximum Temperature: 250°C
Endvacuum: 10-2 mbar
Test-room: 28,5l
Continuous operating temperature
Sample drying 
Drying chamber
BINDER
Maximum Temperature: 300°C
Test room in mm: 400 x 400 x 330
Continuous operating temperature
Sample drying 
Curing 
Drying chamber Heraeus Max. Temperature: 300°C
Heating time from 25°C to 300/150/70°C:
75min/ 30min/ 15min
Continuous operating temperature
Sample drying
Liquid-to-Liquid temperature
shock tester Vötsch VFS
Power: 3,5kW
Temperature limit: -65°C up to +150°C
End of life test
Power cycling tester PCT3 Electricity test area: 0 – 200A
Device under test (DUT): up to 20
Power cycling test
Salt spray and condensation tester Test area volume: 450l
Test material weight: 100kg
Salt spray and condensation test
Ampacity bench Measurement: optical and tactile
temperature measurement
End of life test
derating test
Destructive testing
Equipment Equipment information Testing options (for example)
Universal test machine
ZWICK Z010/TND
Maximal Force: 20N, 500N, 10kN
Test velocity: 0,001-1800 mm/min
Tempering chamber (in preparation)
Compression, Bending, Peeling tests 
Shear tester
XYZTEC Condor 150
max. Shear- und Pull force: 400N
Substrate heating
Sheartest
Pulltest
Hot-Pin-Pull tester DAGE Footprint: W=630mm, D=600mm, H=830mm
Energy supply: 90 – 264V AC 50/60Hz 350W max.
Compressed air supply: 4 bar minium
Hot-Pin-Pull test
Production equipment for the electronics production
Equipment Equipment information Testing options (for example)
Hot stamping / pressing
Embossing equipment
BAIER GEBA 4/6
max. embossing force: 100 kN, max. Temp.: 400°C Hot embossing with Black-oxide foils
Inserting machine
ERNI
Maximum force: 50 kN, Powerstroke: 4 mm Pressing flexible pin
Toggle sinter press Max. operating force: 150% of nominal force
Measurement path 40µm – 80µm
Sintering
Stencil printing / dispensing
Stencil/Screen printer
DEK Horizon
Repeatability: 25 µm @ 6 Sigma Rigid PCBs
Reel-To-Reel-Work process
Rotating dispenser
CAM/ALOT
Placing accuracy: ±0,076 mm @ 3 Sigma
max. 16000 Dots/h, max. Z-movement: 114 mm
Solderpaste, SMD-/Conductive tapes,
Underfiller, Process developemt
Dispenser
MARTIN
Point volume: 0,0005 – 5,0 m³ Solderpaste, SMD-/Conductive tapes,
Underfiller, Process developemt
Precision dispenser
Musashi Shotmaster
Working pressure: 30 – 400 kPA
Temperature: 5 – 60°C
Laser distance measurement
Dispensing of 3D- and uneven surfaces
Component placement
Component placer
SIPLACE F4
SMD Component placer 0201-, Flip Chip-, Bare Die-placement
Flex placement on Vacuum table
Placer SIPLACE HF SMD Component placer Flip Chip-, Bare Die Placement
Component placer
ASM Siplace SX2
SMD Component placer 01005-, Flip Chip-, Bare Die-Bestückung
Component placer
FUJI NXT-2
SMD Component placer 01005-, Flip Chip-, Bare Die-Component placement
Hand component placer
FRITSCH
Semi-automatic manual placement manual placement
Soldering
Reflow oven
HOTFLOW 2/14
7 Hot- und 2 Cool zones, top and bottom Convection soldering under Protective gas
Reflow oven
SEHO MaxiReflow 3.0 HP
6 preheating zones (top and bottom)
2 cooling zones (top)
Overpressure soldering
Vaporphase equipment
IBL LC 280
Medium: 155°C Condensation soldering
Vaporphase equipment
IBL LV 600
Medium: 230°C Condensation soldering
Vapor phase equipment
IBL VAC 645
Vapor phase: 10,4kW
Infrared Preheating: 8kW
Condensation soldering
Rework
Fineplacer
FINETECH
PC controlled SMD-Placer
Heating rate/-Temperature: max. 4K/s, 400°C
with Video imaging
Placement/ Soldering (Ultra-)
Fine Pitch Components:
FC, PLCC, QFP, BGA
Rework station
MARTIN
Precision hot-air/ Rapid-IR-heating Unsolder – removal- resolder
Solder Ball Bumper
PACTECH
Solder ball diameter: 300 µm und 750 µm Reballing of CSP, BGA, Flip Chips
Bonding
Bonder
DELVOTEC
Ultrasonic Wedge-Wedge Bonding
Thermosonic Ball/Wedge Bonding
Thin- (Au)/Thick wire bonds (Al)
Bonder Orthodyne 360c Bonding force: 80 – 1200g
Max. cleave angle: 30°
Thick wire bonds
Additive apply
Laser scribing
LPKF Fusion 1100
Laser power: 20W
Wave length: 1064 nm
Laser pulse frequency: 10 – 200  kHz
MID production with LDS method
Concept Laser Mlab Cusing® Laser: YAG fiber laser
Laser Power: 100W, Wave length: 1070nm
3D structuring, metal powder melting
Plasma dust Temperature limit electronic: 65°C
Temperature limit plasma generator: 200°C
Additive application
3D structuring
Plasma coat PCU3 Powder application: max. 6 g/min
Operating temperature: 10 – 40°C
Additive application
3D structuring
Metallization
Metallization Chemical baths: Cu-, Pd-, Ni-, Au-, etching bath Electroless chemical metallization for LDS
Software
FactoryLogix NPI Software Software for manufacturing execution system Task flow Management
Manufacturing Process Definition
Offline Machine Programming